Government scheme

Semicon India Programme 2.0

Approved in July 2026 with a ₹1,27,500 crore outlay, the second phase expands India's chip ecosystem across design, materials, fabrication, packaging, research and talent.

India Semiconductor Mission / MeitY
Semicon India Programme 2.0

Overview

The Union Cabinet approved the second phase of the Semicon India Programme on 15 July 2026, with a reported outlay of ₹1,27,500 crore under the India Semiconductor Mission.

Why explore it

Hardware teams, design houses and manufacturers can follow the programme's implementation for opportunities across chip design, equipment, materials and advanced packaging. Its relevance depends on a specific approved component or call.

Key facts

Government materials describe six pillars: design; machines and materials; new fabs; advanced packaging; research; and talent development. The programme is intended to deepen the capabilities created in its first phase.

Best next step

Review the official programme updates and the relevant implementing agency's detailed guidelines. Treat the outlay as programme-wide funding; eligibility and applications depend on individual measures.

Check the official programme page

Review current eligibility, deadlines and application instructions with the issuing authority.

Visit official source

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